CAPABILITIES

AXON manufacturing team has experience with a large number of board types and technologies, as well as standard single sided through multilayer product. Whenever you have a special requirement or need a unusual board type, give us a call, we pride ourselves on our customer support.

SPECIAL CAPABILITIES

Multilayer up to 16 Layers

Fine Lines and SMT Pitch

Board thickness 0.008 to 0.250

Carbon Ink Contacts

Oversized Multilayer Boards

Ball Grid Array (BGA) Patterns

Blind and Buried Vias

Peelable/Water Soluble Masks

Plated Slots and Edges

Epoxy Via Plug

Blind Buried Vias

Control Impedance

BOARD TYPES

FR-4 & S1170 equivalent to HI –Temp FR-4

Roger

Taconic

Arlon

Polyimide

Teflon

SURFACE FINISHES

Solder Mask Over Bare Copper (SMOBC)

Hot Air Leveled Solder

Electroless nickel/gold (including bondable gold)

Electroless White Tin

Electroless Silver

Screenable Silver and Carbon

Heavy copper layers